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TZTEK TZDI series laser direct imaging device uses submicron linear module, fully-enclosed optical design and all new generation DMD control technique to provide highly resolved, highly productive and highly accurate features as compared with traditional PCB touch imaging. It is applicable to image transfer of double-sided board, multi-layer board and HDI board in the rigid board field, as well as FPC and IC carrier boards.
SPECIFICATION PARAMETER
* The suggested L/S is related to The dry film and process conditions,subject to the practice
** Environment temperature 22±2℃
*** Environment humidity 55±5%
**** Clean class 10000
***** Optional Automatic line for all LDI type