HIGH THROUPUT MACRO DEFECT INSPECTION
MueTec’s Macro Defect Inspection products are designed for customers with many different wafer types. The system is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process. Our tools can easily be setup without using much floor space. Low acquisition and operating costs guarantee a fast return on invest.
SIGNIFICANT ADVANTAGES
Enabling 100% wafer inspection at lithography
√ Throughput 200 wafer per hour
√ No recipe required for ease of use
√ Replaces manual inspection
√ Simulaneous wafer frontside and backside inspection
√ Highly cost effective solution for fast return on inves
HIGH RESOLUTION MACRO DEFECT INSPECTION
For customers with higher resolution requirements, MueTec provides a high resolution macro defect inspection solution down to 1μm.
SIGNIFICANT ADVANTAGES
√ Recipe-less algorithm: Ideal for wafer fabs with many different product types
√ Cost effective - replaces manual inspection
√ Two simultaneous illumination modes (bright field, dark field)
√ Throughput of 50 wph at 2µm/pixel resolution
√ 300mm FOUP or 200mm SMIF version available
MueTec’s inspection solution for outgoing process control of the sawing process includes all areas of the framed wafer on foil. This includes the inspection of the sawing lines, as well as scratches, cracks, missing dies and particles.
The inspection algorithm follows the recipe-free approach of the Argos product family. Many different product types can be inspected without creating specific recipes.
P0ST-SAWN FRAMED WAFER INSPECTION
KEY FEATURES
√ 380 mm framed wafer FOUP based handling
√ Optimized for multi-zone inspection of wafer, foil and frame. Detected defects include:
Sawing line failures
Cracks
Scratches
Bubbles in foil on frame and wafer
Holes in foil
Etc.
√ Data acquisition perfectly balanced to mechanical movements
√ Simultaneous brightfield and dark field inspection
NO RECIPE REQUIRED FOR EASE OF USE:
√ Enables productivity gains through minimum recipe customization
√ Ideal for fabs and packaging areas with many different devices & die sizes
√ No learning of alignment marks, chip size or wafer center necessary. Die layout data is not necessary
√ Recognition of active die area and EBR zone
√ Different sensitivities for different wafer areas
√ Avoiding false positives at zone transitions
√ Automatic adjustment of light intensity
√ Reflectivity of inspected layer is not necessary
√ Automatic defect recognition parameters by adaptive software algorithm
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200mm MEMS inspection and metrology system (SMIF)Rembrandt 200 / 300
Typical Applications
Macro defect inspection of 200mm and 300mm wafer
Features
200mm SMIF or 300 mm FOUP based handling
Data acquisition perfectly balanced to mechanical movements
Illumination: Bright and darkfield, LED based
Black/white and colored image of sample
Modular system architecture results in small footprint
Design allows addition of 3rd module and 4th FOUP
Throughput optimized & balanced system integration avoids bottlenecks
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Post-saw Framed Wafer InspectionArgos 300The Argos 300-F product is optimized for post-saw inspection of framed wafer on foil. With a high throughput of 110 300mm wafer on a 380mm frame, the system inspects many different defect types, from sawing line failures to defects on the foil and on the frame.
Features
380 mm framed wafer FOUP based handling
Optimized for multi-zone inspection of wafer, foil and frame.
Data acquisition perfectly balanced to mechanical movements
Simultaneous brightfield and dark field inspection
No recipe required for ease of use
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Post-saw Framed Wafer InspectionArgos 200The Argos 300-F product is optimized for post-saw inspection of framed wafer on foil. With a high throughput of 110 300mm wafer on a 380mm frame, the system inspects many different defect types, from sawing line failures to defects on the foil and on the frame.
Features
200 mm framed wafer FOUP based handling
Optimized for multi-zone inspection of wafer, foil and frame.
Data acquisition perfectly balanced to mechanical movements
Simultaneous brightfield and dark field inspection
No recipe required for ease of use
