HIGH THROUPUT MACRO DEFECT INSPECTION
MueTec’s mask inspection is using a die-to-die approach to detect statistical failures on the mask. This tool is used to monitor the masks in wafer manufacturing, typically in power semiconductor, LED and MEMS manufacturing.
Our tool helps the customer to automatically decide if the photomask is good, requires cleaning or needs to be replaced.
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Automatic and fully enclosed with FFUSpector
Typical Application
Mask defect inspection
Key Features
Fully enclosed tool architecture
Robot handling of masks with up to 2 pod or cassette stations
Automatic inspection based on die-to-die comparison
Resolution of 0,5 μ/pixel
Defect sizes as of 1 μm
Mask sizes up to 14’’
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Automatic with mask robot and mask carriersSpector ATypical Application
Mask defect inspection
Features
Open tool architecture
Robotor mask loading and unloading
Fully automatic mask inspection
Automatic inspection based on die-to-die comparison
Resolution as of 0,5 μ/pixel
Defect sizes as of 1 μm
Mask sizes up to 14’’
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Semi AutomaticSpector MTypical Application
Mask defect inspection
Features
Open tool architecture
Manual operator mask loading and unloading
Automatic inspection based on die-to-die comparison
Resolution as of 0,5 μ/pixel
Defect sizes as of 1 μm
Mask sizes up to 14’’
