Laser Direct Imaging

Equipment Model	TZDI-6	TZDI-12	TZDI-20	TZDI-25	TZDI-35
Substrate Size	630×660 mm	630×810 mm	550×810 mm	530×850 mm	630×810 mm
Substrate Thickness	0.025-5.0 mm	0.02-5.0 mm	0.05-5.0 mm	0.05-5.0 mm	0.05-5.0 mm
Limit	6 μm	12 μm	20 μm	25 μm	35 μm
MP Analysis	12 μm	20 μm	35 μm	40 μm	50 μm
Linewidth Accuracy	±10%	±10%	±10%	±10%	±10%
Alignment Accuracy	±6μm	±8μm	±8μm	±12μm	±12μm
Inter Layer Alignment Accuracy	10 μm	16 μm	24 μm	24 μm	24 μm
Maximum Capacity	20mj / s @30	20mj / s @14	20mj / s @8	20mj / s @8	20mj / s @8.5
Recommended Application	IC substrate	IC substrate,SLP	HDI,MLB和FPC	PCB, FPC	MLB (inner and outer layer) ceramic substrate

Equipment Model	TZUVDI-20	TZUVDI-35
Substrate Size	600×660 mm	609×810 mm
Substrate Size	（550×610 mm, 630×810 mm）	609×810 mm
Substrate Thickness	0.05-5.0 mm	0.05-5.0 mm
Minimum Window	50 μm	100 μm
Minimum resistance welding Bridge	50 μm	75 μm
Linewidth Accuracy	±10%	±10%
Alignment Accuracy	±12μm	±12μm
Inter layer alignment accuracy	24 μm	24 μm
Maximum Capacity	50seconds / face @ 300MJ	12 seconds / face @ 300MJ
Recommended Application	Soft board and hard board anti welding, inner and outer circuit	Soft board and hard board anti welding, inner and outer circuit
Other	/	415nm light source is selected for white oil application

Equipment Model	TZLUVDI-35
Substrate Size	630×810 mm
Substrate Thickness	0.05-5.0 mm
Minimum Window	100 μm
Minimum resistance welding Bridge	75 μm
Linewidth Accuracy	±10%
Alignment Accuracy	±12μm
Inter layer alignment accuracy	24 μm
Maximum Capacity	10.5s /face @ 500mj/cm2
Maximum Capacity	15s / face @ 1000mj/cm2
Recommended Application	Soft board and hard board anti welding, inner and outer circuit

VMG Gantry