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TZTEK’s inspection solution is optimized for sawing process control. Without any special recipe set up, defects such as, scratches, cracks, dirt, die missing and particles, as well as holes, bubbles and waves on the frame and tape could be detected from all areas of a framed wafer.
main features
optimized for multi-area inspection of wafer, tape and frame, different sensitivities available for different areas
Inspection includes: sawing line, cracks, scratches, dirt and holes, bubbles and waves on the frame and tape
Simultaneous bright field and dark field illumination
Less recipe setup
SECS/GEM
