SPECIFICATION PARAMETER
Specification Parameter
Model | AVI-IC-A025C | |||||
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CCD resolution(μm/pixel) | 2.5 (front), 5 (back) (16K color high-precision CCD) | |||||
External dimensions(mm) | 1790×2250×1990(L×W×H) | |||||
Equipment weight(t) | 3 | |||||
Equipment power( Vac,Hz,KW) | 380,50,16 | |||||
Processing method | Full automatic double-sided scanning, NG slot, slot to be inspected | |||||
Inspection area(mm) | 30×50(MIN) | 120×300(MAX) | ||||
CT(pnl/h) |
Plate width<40 mm(Once scan):270 40 mm≤Plate width<80 mm(Twice Scan ):200 80 mm≤Plate width<120 mm(Triple scan):140 (Double-sided inspection) |
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Reference material format | Gerber (RS274X)、ODB++ | |||||
Detection board thickness(mm) | 0.06 - 2 | |||||
Defect confirmation | VRS off-line decision | |||||
Defect range |
Copper surface area covered by gold surface/organic flux: scratches, pinholes, gold particles, metal bumps, dents, discolorations, copper leakage, contamination, nicks, insufficient etching, excessive etching, foreign matters, non-gold plating, circular PAD diameter out-of-tolerance Anti-welding zone: scratch, lack of anti-welding (exposed gold/exposed copper/exposed base material), through hole (exposed gold/exposed copper), foreign matter, green paint peeling, green paint offset, pollution, green paint crack, small hole plugging Base material area: copper residue, scratch and bottom leakage Line area: notch, open circuit, short circuit, scratch, exposed copper, pinhole, gold particle, metal bump, discoloration, oxidation, pollution, foreign matter, insufficient etching, excessive etching Line area under green paint: notch, open circuit, short circuit, scratch, foreign matter |
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Detection material | Type of substrate: PBGA、CSP、 RF、 COB、 OSP、BOC、MMG、WBGA、PSAP、MCM-BGA、FCBGA、uBGATM | |||||
Temperature and humidity | 22±2℃ , 50±10% |