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Specification Parameter

Model AVI-IC-A025C
CCD resolution(μm/pixel) 2.5 (front), 5 (back) (16K color high-precision CCD)
External dimensions(mm) 1790×2250×1990(L×W×H)
Equipment weight(t) 3
Equipment power( Vac,Hz,KW) 380,50,16
Processing method Full automatic double-sided scanning, NG slot, slot to be inspected
Inspection area(mm) 30×50(MIN) 120×300(MAX)

Plate width<40 mm(Once scan):270

40 mm≤Plate width<80 mm(Twice Scan ):200

80 mm≤Plate width<120 mm(Triple scan):140

(Double-sided inspection)

Reference material format Gerber (RS274X)、ODB++
Detection board thickness(mm) 0.06 - 2
Defect confirmation VRS off-line decision
Defect range

Copper surface area covered by gold surface/organic flux: scratches, pinholes, gold particles, metal bumps, dents, discolorations, copper leakage, contamination, nicks, insufficient etching, excessive etching, foreign matters, non-gold plating, circular PAD diameter out-of-tolerance

Anti-welding zone: scratch, lack of anti-welding (exposed gold/exposed copper/exposed base material), through hole (exposed gold/exposed copper), foreign matter, green paint peeling, green paint offset, pollution, green paint crack, small hole plugging

Base material area: copper residue, scratch and bottom leakage

Line area: notch, open circuit, short circuit, scratch, exposed copper, pinhole, gold particle, metal bump, discoloration, oxidation, pollution, foreign matter, insufficient etching, excessive etching

Line area under green paint: notch, open circuit, short circuit, scratch, foreign matter

Detection material Type of substrate: PBGA、CSP、 RF、 COB、 OSP、BOC、MMG、WBGA、PSAP、MCM-BGA、FCBGA、uBGATM
Temperature and humidity 22±2℃ , 50±10%