SPECIFICATION PARAMETER
Specification Parameter
Model | AVI-M15C | AVI-M10C | AVI-M05C | AVI-M035C | |
---|---|---|---|---|---|
CCD resolution(μm/pixel) | 15 | 10 | 5 | 3.5 | |
External dimensions(mm) | 1962×1490×1820(L×W×H) | ||||
Equipment weight(t) | 1.1 | ||||
Equipment power( Vac,Hz,KW) | 380, 50,7 | ||||
Processing method | Manual loading and unloading | ||||
Inspection area(mm) | 600×600(MAX) | ||||
CT(s/side) | 24( Take 430×250 mm product with 10 μm resolution as an example) | ||||
Detection board thickness(mm) | 0.06-2 | ||||
Defect confirmation | AVI online confirmation + VRS fission confirmation | ||||
Defect range |
Substrate inspection: finger burrs, copper slag Text inspection: missing printing, incomplete Circuit inspection: notch, bump copper, oxidation, indentation, pinhole Gold surface inspection: scratches, heterochrome, exposed copper, oxidation, reinforcement migration (measurement) Reinforcement inspection: missing, defects, foreign matter, burrs, air bubbles, reinforcement migration (measurement) PAD inspection: scratches, oxidation, heterochrome, exposed copper CVL inspection: deviation, foreign matter, breakage Shielding film inspection: deviation, breakage Poor punching:deviation (measurement, inspection) Drilling inspection: porous, few holes, hole deviation, hole-filling, hole ring too thin Ink: exposed copper, dirty, scratched |
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Applicable board range | Suitable for HASL board, immersion gold board, gold-plated board, immersion silver board, immersion tin board, OSP anti-oxidation board, etc. | ||||
Temperature and humidity | 22±2℃ , 50±10% |